Intel technologies Looking for Packaging Research and Development Engineer at Phoenix, Arizona Full Time

Are you looking for pathfinding work and project ownership that ties mechanical engineering principles to tool operation and process development to enable advanced assemblies and packaging?

Then come join our multi-disciplinary team in the Assembly and Hybrid Bonding Prototyping Labs within the Assembly and Test Technology Development (ATTD) group at Intel.

We collaborate with component research, development, and product teams to build and prototype tomorrow’s future products, often making that deemed impossible possible.

In this role you will be responsible for enabling solder-based and hybrid assemblies leveraging state-of-the-art microelectronics packaging equipment.
You will be responsible for detailed process understanding, including but not limited to

• Process flows in HPL and APL Laboratories
• Process and move the pathfinding lots in APL and HPL WITH “zero” excursions
• Chip attach/thermal compression bonding, Hybrid bonding and Die Prep methods and corresponding Inspections
• Assembly materials including solders, solder pastes, fluxes, underfills, die attach films
• Building out comprehensive experimental plans to ensure reproducibility of your results and process
• Design of representative experiments, including characterization and analysis to make data-driven decisions
• Working with equipment and material vendors to account for variabilities in tool operation or material supply

The candidate should also exhibit the following behavior traits and/or skills:

• Working and excelling within a cross-disciplinary team where independent output to timeline was demonstrated
• Attention to detail
• A learning pre-disposition and desire to connect observation with physical fundamentals
• Initiative, resourcefulness, and work independently
• Communication skills
• Planning and execution to timeline

You will work within a team, but have clear, individual project deliverables with time-constraints that support the success of the team.

This is an entry level position and compensation will be given accordingly.

Qualifications

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications

• Possess a bachelor’s degree (Candidate must possess the degree by employment start date) in mechanical engineering or manufacturing or precision engineering or relevant field and 3+ months of experience with one or more of the following:
• Design, analysis, and interpretation of comprehensive experiments with control legs
• Operation and programming of assembly equipment/familiarity with robotics, mechatronics, etc.

Preferred Qualifications

• Possess a bachelor’s degree (Candidate must possess the degree by employment start date) in mechanical engineering or manufacturing or precision engineering or relevant field and 1+ years of experience with one or more of the following:
• Design, analysis, and interpretation of comprehensive experiments with control legs
• Operation and programming of assembly equipment/familiarity with robotics, mechatronics, etc.

1+ years of experience with one or more of the following:

• Solder based assembly, solder alloys or metallurgical understanding
• Model Based Problem Solving
• Working and running equipment in a clean-room environment

Inside this Business GroupAs the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Covid StatementIntel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.htmlWorking ModelThis role will require an on-site presence.