QualificationsPackagingFabricationSurface mount technologySolderingBachelor’s degree
At Facebook Reality Labs (FRL), our goal is to explore, innovate and design novel interfaces and hardware subsystems for the next generation of virtual, augmented, and mixed reality experiences. We are looking for a skilled and motivated Packaging Fabrication Engineer to join our team, whose mission is to design, build, and test prototype systems for future consumer VR and AR experiences. We are specifically looking for a candidate with experience in packaging engineering and fabrication and who can work with a team of researchers who are focused on device and system-level packaging for wearable electronics. More broadly, the chosen candidate will work with a diverse and highly interdisciplinary team of researchers and engineers and will have access to cutting edge technology, resources, and testing facilities.
Design, manufacturing engineering, and process development of component integration into multi-chip modules (MCMs), System-In-Package (SiP), and Printed Circuit Board Assembly (PCBA) on Flexible Printed Circuits (FPCs) for wearable electronic prototype applications.
Package design, assembly, and reliability testing for custom devices and systems with an emphasis on Design for Excellence (DfX). Establish and lead execution of process optimization using Design of Experiments. Implement and disseminate design rules and Process Development Kits (PDKs) to cross-functional teams.
Apply and adapt industry Best Known Methods (BKMs) for electronics packaging technologies to wearable electronics with a broader set of materials and system-level performance goals.
Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field, or equivalent industry experience.
5+ years experience with advanced packaging, PCBA, and related technologies.
Experience with SMT technologies including conventional soldering, eutectic bonding, metal finishing, flip-chip, wire/die bonding, ball/stud bumping, underfill, over molding or other encapsulation methods.
Interpersonal experience: cross-group and cross-culture collaboration.
Must obtain work authorization in country of employment at the time of hire, and maintain ongoing work authorization during employment.
Experience in the domain of advanced packaging including FPC, MCM, SiP, 2.5D/3D integration or Flexible Hybrid Electronics (FHE), or similar technologies.
5+ years experience with advanced packaging, PCBA, and related technologies, preferably in consumer, wearable, or ruggedized electronics.
2+ years of experience with wearable technologies and technical soft goods.
Working experience with reliability testing and failure analysis tools including die/ball shear/wire pull testing, X-ray, C-SAM, thermal cycling and other environmental testing.
Familiarity with hermetic/MEMS packaging processes, thermal management/materials, and injection/transfer molding.
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