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Google Hiring for Packaging Substrate Technologist at Mountain View, CA Full Time
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Minimum qualifications:
- 5 years of experience working with substrate vendors to develop packaging substrate technology
- Experience working with Outsourced Semiconductor Assembly and Test (OSATs) and foundries for packaging assembly, qualification, and ramp to mass production.
- Experience in leadership of technology development with vendors/suppliers and driving technical selections with cross-functional teams.
Preferred qualifications:
- PhD in Materials, Electrical, or Mechanical Engineering or equivalent practical experience.
- Experience in advanced PCB and SMT technology.
- Experience with research and development and technology bring-up to production for mobile and consumer products.
- Knowledge of packaging design, electrical, thermal, and mechanical analysis, system level integration, and performance/cost trade off.
- Understanding of Allegro design tools and flow.
- Excellent problem-solving skills with excellent attention to detail.
About the job
Google engineers develop the next-generation technologies that change how users connect, explore, and interact with information and one another. As a member of an extraordinarily creative, motivated and talented team, you develop new products that are used by millions of people. We need our engineers to be versatile and passionate to take on new problems as we continue to push technology forward. If you get excited about building new things and working across discipline lines, then our team might be your next career step.
Google’s mission is to organize the world’s information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people’s lives better through technology.
Responsibilities
- Lead SoC packaging and System-in-Package (SiP) module and substrate technology pathfinding, define product design strategy, and drive product development to mass production.
- Track and influence vendor advanced packaging substrate roadmap, drive external vendors from technology definition to qualification.
- Establish substrate technology development methodology. Conduct Design of Experiments (DOEs) using test vehicles for Bill of Material (BOM) selection, design rule validation, manufacturing process window, and reliability confirmation.
- Work with SoC, package and board design and manufacturing teams to co-optimize chip-to-package-board integration to support high volume manufacturing.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google’s EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.
