QualificationsPackagingManufacturingAssemblySoCMechanical engineeringDoctoral degreeDoctor of Philosophy
PhD in Mechanical Engineering, Materials Science, or a similar field
Experience in advanced packaging technologies (e.g., wafer-level packaging, 2.5D interposer/bridge, 3D die-stacking, System-in-Package (SiP), flip-chip, and advanced substrate technologies)
Experience working with foundries and Outsource Supply Assembly and Tests (OSATs) to bring advanced SoCs to production
Knowledge of packaging design, electrical, thermal, and mechanical analysis, system level integration, performance, and cost trade offs
Excellent attention to detail, problem-solving skills, and commitment to achieve technical excellence
About the job
Google engineers develop the next-generation technologies that change how users connect, explore, and interact with information and one another. As a member of an extraordinarily creative, motivated and talented team, you develop new products that are used by millions of people. We need our engineers to be versatile and passionate to take on new problems as we continue to push technology forward. If you get excited about building new things and working across discipline lines, then our team might be your next career step.
Google’s mission is to organize the world’s information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people’s lives better through technology.
Lead packaging integration efforts and work with systems architects to define our custom SoC package mechanical, thermal, power, electrical, and reliability requirements.
Drive collaboration with cross-functional internal teams, OSAT, and material suppliers to deliver total chip package solution for volume production.
Work with the SoC Design team on chip, interconnect, and package co-design to meet design for manufacturing (DFM), electrical, thermal, and power and reliability requirements.
Establish package development plans, specification and task lists. Conduct design of experiments (DOEs) using test vehicles for build of materials selection, confirm assembly and manufacturing process windows, and ensure systems reliability requirements are met.
Drive IC packaging industry with innovations, technology roadmap development, packaging solutions, methodologies, and specifications.
Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google’s EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.