Google Looking For Packaging Research Engineer, Advanced Packaging, Quantum AI at Goleta, CA Full Time

Minimum qualifications:
Bachelor’s degree in a technical field or equivalent practical experience and 4 years of experience with design and test of electronics packaging

Experience with microwave design, test, and analysis

Experience with process development in silicon advanced packaging technologies

Experience with a scripting or a programming language

Preferred qualifications:
Experience with cryogenics

Experience with reliability analysis

Experience with mechanical design

Experience with superconducting materials

Proficiency with python

About the job

The Quantum team’s mission is to make useful quantum computing tools available to the world to enable humankind to solve problems that would otherwise be impossible. Quantum AI is building novel systems that can leverage quantum mechanics to outperform the world’s largest computers at certain classes of problems.

In the device packaging group, we build custom packaging technologies for quantum processors, amplifiers, and other devices that operate from DC to microwave frequencies in a cryogenic environment. Our work includes research on quantum processor performance and cubit environment, design of novel packages and test articles, investigation of new technologies, and hardening of new technologies for deployment. Every Google Quantum AI processor comes through our lab for packaging before its deployment to the fleet.

As a Packaging Research Engineer, you will be responsible for developing advanced packaging interconnected technologies for packaging cryogenic microwave devices. You will collaborate with researchers and engineers on the Quantum AI team, as well as academic and industrial partners externally, to develop the packaging and integration technologies used in our next generation of quantum computers. You will manage multiple complex projects simultaneously, spanning silicon, PCB, and Micro-Electro-Mechanical-System (MEMS) interconnect technologies.

Responsibilities

Develop PCB and silicon-based advanced packaging technologies for integrating cryogenic microwave devices.

Scope and purchase tools needed for process development of microwave interconnect technologies, develop processes, and determine the capabilities and limits of newly developed processes.

Write and execute test plans (e.g., assess achievable pitch, electrical performance, yield/reliability).

Collaborate with academic and industrial partners as a project technical lead for technology development.

Write documentation and transfer newly developed processes to in-house or external production.

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google’s EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.