Google Looking For Packaging Substrate Technologist at San Diego, CA Full Time

Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Mountain View, CA, USA; San Diego, CA, USA.

Minimum qualifications:
Master’s degree in Materials, Electrical, Mechanical Engineering, or equivalent practical experience

5 years of experience working with vendors to develop packaging technology for flip-chip, and/or SiP products

Experience working with OSATs for package assembly, qualification, and mass production

Experience leading technology selections with cross-functional teams and driving technology development with vendors/suppliers

Preferred qualifications:
PhD in Materials, Electrical, or Mechanical Engineering, or equivalent practical experience

Experience with research/development and technology bring-up to production

Experience with mobile/consumer products and Allegro design tools and flow

Experience in advanced PCB and SMT technology

Ability to problem-solve with excellent attention to detail, take initiative in critical situations, and commit to achieve technical excellence

Knowledge of packaging design, electrical, thermal and mechanical analysis, system level integration, performance and cost trade-off

About the job

Google engineers develop the next-generation technologies that change how users connect, explore, and interact with information and one another. As a member of an extraordinarily creative, motivated and talented team, you develop new products that are used by millions of people. We need our engineers to be versatile and passionate to take on new problems as we continue to push technology forward. If you get excited about building new things and working across discipline lines, then our team might be your next career step.

A a Packaging Substrate Technologist, you will develop products that are widely used by our customers.

Google’s mission is to organize the world’s information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people’s lives better through technology.

Responsibilities

Lead SoC packaging, SiP module, substrate technology pathfinding, define product design strategy, and drive product development to mass production.

Track and influence vendor advanced packaging substrate roadmap, and drive external vendors from technology definition to technology qualification.

Establish substrate technology development methodology. Conduct design of experiments by using test vehicles for bill of material selection, design rule validation, and manufacturing process window and reliability confirmation.

Work with SoC, package, board design, and manufacturing teams to co-optimize chip-to-package-board integration to support high-volume manufacturing.

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google’s EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.