Your Role and Responsibilities
The position is for a Semiconductor Process Engineer with a focus on processes related to semiconductor packaging. The processing engineer will specifically work on bump bonding technology, but a variety of packaging processes will also be important, such as dry film lithography, direct-write lithography, inspection, metrology, wet cleans, physical vapor deposition (PVD), reactive ion etching (RIE), wafer dicing and silicon integration processing in general. The engineer will be a part of a team at the IBM T.J. Watson Research Center, Microelectronics Research Laboratory (MRL), which provides world class 200mm wafer scale fabrication services to multiple clients including Quantum Computing, Artificial Intelligence Center in Albany, as well as multiple Joint Development clients with projects in Health Care and Life science, and the Internet of Things. The engineer will collaborate with these teams’ developing hardware for the state of the art technologies.
This position is located in the Yorktown Heights, NY area.
Required Technical and Professional Expertise
Preferred Technical and Professional Expertise
With more than 3,000 researchers in 12 labs located across six continents, IBM Research brings together hundreds of researchers who possess unparalleled industry expertise to address some of the world’s most challenging problems. Join us as we do pioneering work in areas such as cognitive computing, augmented intelligence, quantum computing, and blockchain, to name a few.
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It’s time to define your career.
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IBM offers a wide range of resources for eligible IBMers to thrive both inside and outside of work. In addition to a competitive benefits program consisting of medical and life insurance, retirement plans, and time off, eligible employees may also have access to:
We consider qualified applicants with criminal histories, consistent with applicable law.
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