Intel technologies Looking for Lead Assembly Integration Engineer at Phoenix, Arizona; Hillsboro, Oregon Full Time

Microelectronic Packaging Engineers in Assembly and Test Technology Development (ATTD) will be expected to:

-Provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

-Representing ATTD in product development and execution teams.

-Be responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages.

-Define overall package performance and specification and realizes technology certification through layout design and test vehicle design.

-Establishing the technology development strategy and timeline to align with product needs.

-Working with assembly module engineering to establish assembly process flows.

-Working with Chandler and ATM on technology development and HVM transfer activities.

-Coordinating closely with quality and reliability, product divisions, and module engineering on risk assessments and qualification activities.

-Leading cross-functional task forces, focus teams, and working groups as needed to resolve integrated process issues and participating in module-specific forums.

This position supports hybrid work model.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Candidate must possess a Master’s degree with 4+ years of experience or Ph.D degree with 2+ years of experience in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Optical, Materials Science, Physics or Chemistry.
• 5+ years of experience in microelectronic packaging.
• 1+ years of experience in fundamental science and engineering concepts in development to create novel solutions, including knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

Preferred Qualifications:

• 1+ years of experience in the following:

-Interaction and handling customers and suppliers.
-Assembly module process and tool development.
-Quality and reliability requirements such as: BHAST, Temp cycling, shock, vibration, compression and Electrostatic Discharge (ESD) static dissipative and decay tests.
-Experience writing USG.

-Experience in optical packaging.

Inside this Business GroupAs the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Other LocationsUS,HillsboroCovid StatementIntel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.htmlWorking ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.