Intel technologies Looking for Substrate Packaging Research and Development Engineer-Technology Transfer Engineer at Phoenix, Arizona Full Time

Become a part of Intel’s Advance Packaging Team by joining the Substrate Packaging Technology Development (SPTD) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging.

Join the SPTD organization to assist in achieving our mission and continuing to make this a great place to work. This position is a Technology Transfer Engineer role within Substrate Packaging Technology Development (SPTD) and the candidate will be in charge of working with suppliers in Asia to develop their next GEN equipment and processes, and partner with the internal team on the technology transfer of key building blocks and state of the art technology.

The responsibilities include but are not limited to the following:

– Be a substrate module integrator that can lead and guide the supplier in their material, equipment and process development to meet the next GEN design, product and quality/reliability requirements.
– Partner closely with SPTD internal module engineers on technology transfer of key building blocks including tool quals, fingerprinting, process window characterization and certification activities.
– Work with engineers at suppliers in Asia to drive their process, equipment, material and technology development to meet Intel requirements, and ensure robust technology transfer to the suppliers.
– Partner closely with internal customers including supplier integrators to identify product requirements, and drive module-level deliverables to program and product technical and schedule requirements.
– In-depth knowledge with hands-on experience of Fab/substrate manufacturing process, technology such as Lithography, laser, lamination, plating or etch processes.
– Problem-solving skills, and an aptitude and capability to deep dive into the fundamental root cause and identify a robust solution for technical issues.
– Demonstrated skills with tools and process PCS, data analysis, statistical tools and methods.
– Demonstrate experience with material characterization techniques such as SEM, XPS, FTIR, FIB etc.
– Collaborating closely with internal partners and customers to deliver the program and organizational requirements.
– Willing to work in a highly matrixed organization across partner groups, cultures and time zones.
– Clear communication and presentation skills are a must.
– Supplier management and integration experience are preferred.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

– Candidate must possess a BS degree with 4+ years of experience or MS degree with 3+ years of experience or a PhD degree with 1+ years of experience in Materials Science and Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, Mechanical Engineering, or related engineering degree.

Inside this Business GroupAs the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Covid StatementIntel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs. Find more information about our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.htmlWorking ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.